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Update LICENSE to Soldered
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LICENSE
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LICENSE
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MIT License
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Copyright (c) 2021 Harvey Mudd College & Oklahoma State University
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Contact: Prof. David Harris David_Harris@hmc.edu
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Permission is hereby granted, free of charge, to any person obtaining a copy
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of this software and associated documentation files (the "Software"), to deal
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in the Software without restriction, including without limitation the rights
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to use, copy, modify, merge, publish, distribute, sublicense, and/or sell
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copies of the Software, and to permit persons to whom the Software is
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furnished to do so, subject to the following conditions:
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The above copyright notice and this permission notice shall be included in all
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copies or substantial portions of the Software.
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THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR
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IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES OF MERCHANTABILITY,
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FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE
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AUTHORS OR COPYRIGHT HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER
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LIABILITY, WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING FROM,
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OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR OTHER DEALINGS IN THE
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SOFTWARE.
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// Copyright (C) 2021-23 Harvey Mudd College & Oklahoma State University
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//
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// SPDX-License-Identifier: Apache-2.0 WITH SHL-2.1
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//
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// Licensed under the Solderpad Hardware License v 2.1 (the “License”); you may not use this file
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// except in compliance with the License, or, at your option, the Apache License version 2.0. You
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// may obtain a copy of the License at
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//
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// https://solderpad.org/licenses/SHL-2.1/
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//
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// Unless required by applicable law or agreed to in writing, any work distributed under the
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// License is distributed on an “AS IS” BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND,
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// either express or implied. See the License for the specific language governing permissions
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// and limitations under the License.
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